THERMAL & HYDRAULIC PERFORMANCE ON MICRO-CHANNELS MANIFOLD ARRANGEMENTS - Softcover

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Heat generated by the electronic devices must be dissipated to the environment for better performance, improving reliability and preventing failure. According to Moore’s law of semiconductor the transistor density doubles roughly every 18 months causing higher heat load. So, the past couple of decades have witnessed a rapid progress in the applications of miniaturization forcing the size of the circuits with high demand on increased operating speeds and package densities. Heat sink is an object or system that absorbs or dissipates heat from another using direct or radiant thermal contact. It is seen that heat sink transfers thermal energy from a source at higher temperature to a fluid medium at a lower temperature. Heat sinks are used in integrated circuits and power handling semiconductors to reduce their temperature through increased thermal mass and heat dissipations. It can also be used in case of refrigeration, electronic cooling, high performance microprocessors, chemical process and power systems. Micro-channels and mini-channels based heat sinks are provided large surface to volume ratio. The greatest advantage of micro-channels heat sinks are high heat transfer rate obtained from a large surface to volume ratio. Micro scale heat transfer has received more interest due to decrease in the size of devices, such as in electronic equipment’s because there is an increase in amount of heat to be dissipated per unit area. The performance of these devices is largely depends on their temperature. So, it is an important issue to keep the electronics at reasonable temperature levels. Micro-channels heat sinks are known as one of the effective cooling techniques. Various researchers have looked for finding the ways of cooling to improve the performance of system. They have investigate the liquid flow based MCHS for thermal management of electronics devices. The researchers have looked for efficient cooling technique, taking into account the cost, leakage and reliability of system. Microchannel heat sink has an inlet manifold, from where the liquid is supplied to the array of micro-channels and an outlet manifold, from where the liquid is collected after being passed through the micro-channels. These inlet and outlet manifolds are arranged in many different ways by number of researchers. As the different fluid flow arrangements have proposed, due to that reasons the different fluid flow arrangements are expected to affect the heat transfer and fluid flow characteristics within the micro-channels heat 5 sink. However, it is important to investigate the effects of inlet and outlet manifold arrangements for better micro-channels heat sink performance. The literature review indicates that research work available by many of researchers have focused on the heat transfer and fluid flow analysis within the micro-channels. However, no detailed experimental study has been carried in order out to get the effects of flow arrangements and shape inlet and outlet manifold arrangements on the performance of MCHS. In order to check the performance of the heat sink, it is necessary to investigate the effects of inlet and outlet manifold arrangements on heat transfer performance of micro-channels. In the present research work, micro-channels with three different tapered manifold arrangements were fabricated to study the effects of inlet and outlet manifold arrangements shapes on the performance of MCHSs. In this research work, shape and number of micro-channels were same in all three different test pieces, and the difference was only due to the shape of three different inlet and outlet manifold arrangements. The flow configuration was also same in all three cases. The experimental results were obtained with the help of five heat input values (50W, 75W, 100W, 125W and 150W), four Reynolds numbers (575.16, 690.19, 805.23 and 920.26), and the hydraulic diameter of micro-channel 833µm and taking total 60 experimental trial runs.

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