Passive RF Component Technology: Materials, Techniques, and Applications: Novel Materials, Techniques, and Applications - Hardcover

9781608071999: Passive RF Component Technology: Materials, Techniques, and Applications: Novel Materials, Techniques, and Applications

Hardcover

ISBN 10: 1608071995 ISBN 13: 9781608071999

Verlag: Artech House Publishers, 2011

Alle Exemplare dieser ISBN-Ausgabe

1 Gebraucht

Von EUR 74,95

2 Neu

Von EUR 87,11

Focusing on novel materials and techniques, this pioneering volume provides engineers with a solid understanding of the design and fabrication of smart RF passive components. Professionals find comprehensive details on LCP, metal materials, ferrite materials, nanomaterials, high aspect ratio enabled materials, green materials for RFID, and on-chip silicon techniques.

Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch-based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance-improving and cost-down solutions this technology offers the next generation of wireless communications.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

�ber die Autorin bzw. den Autor

Guoan Wang is an assistant professor at the University of South Carolina and was an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.
Bo Pan is a staff engineer at Broadcom and was previously a senior RF engineer at the Realtek Semiconductor Corporation. He holds an M.S. in electrical engineering horn Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.

��ber diesen Titel� kann sich auf eine andere Ausgabe dieses Titels beziehen.