Engineering Applications of Residual Stress, Volume 8: Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics (Conference ... Society for Experimental Mechanics Series) - Softcover

 
9781461429067: Engineering Applications of Residual Stress, Volume 8: Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics (Conference ... Society for Experimental Mechanics Series)

Inhaltsangabe

Engineering Applications of Residual Stress represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, and Thermomechanics and Infra-Red Imaging.

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Engineering Applications of Residual Stress represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference & Exposition on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011.? The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

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9781461402244: Engineering Applications of Residual Stress, Volume 8: Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics: 999 ... ... Society for Experimental Mechanics Series)

Vorgestellte Ausgabe

ISBN 10:  1461402247 ISBN 13:  9781461402244
Verlag: Springer-Verlag New York Inc., 2011
Hardcover