This book is for PCB designers who are designing boards with multiple very large Ball Grid Array (BGA) packages. It explores the impact of dense BGAs with high pin-count on PCB design and provides solutions for the inherent design challenges. Though you may not yet have been confronted with the difficulties of routing BGAs and the impact on fabrication costs and signal integrity, this book will reveal these potential pitfalls as well as methods to mitigate these problems.
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Charles Pfeil is an Engineering Director at Mentor Graphics Systems Design Division. He was the original product architect for Expedition PCB and is an inventor of XtremePCB, TeamPCB and XtremeAutoRoute. Charles has been in the PCB industry for over 40 years as a designer, owner of a service bureau, and has also worked in marketing and/or engineering management at Racal-Redac, ASI, Cadence, PADS, and VeriBest. He can be contacted through email at firstname.lastname@example.org. To find more information about Mentor PCB products visit, www.mentor.com/pcb
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