Thin-Film Capacitors for Packaged Electronics - Softcover

Inhaltsangabe

Preface. Acknowledgements. 1: Introduction. 1.1. Capacitor Fundamentals. 1.2. Application Domains. 1.3. Physical Structures/Embodiments. 1.4. Capacitor Integration Drivers. 1.5. Thin-Film Capacitor Technology. 1.6. Summary. 1.7. References. 2: Design Fundamentals. 2.1. Breakdown Voltage and Capacitance Density Design Limits. 2.2. Tolerance in Capacitance Density. 2.3. DC Leakage. 2.4. Capacitor Losses. 2.5. Series Inductance and Resistance. 2.6. References. 3: Performance Detractors. 3.1. Interfacial Micro-roughness. 3.2. Deviation from Optimal Stoichiometry. 3.3. Film Microstructure. 3.4. References. 4: Electrical Characterization. 4.1. Thin Film Decoupling Capacitors. 4.2. Characterization Methodologies. 4.3. Test Vehicle: Design and Fabrication. 4.4. Dielectric Constant and Loss. 4.5. Total Series Inductance. 4.6. Leakage Current Density. 4.7. Capacitance Density and Breakdown Field. 4.8. Summary and Conclusion. 4.9. References. 5: Integration Issues And Challenges. 5.1. Metal Diffusion into Dielectrics. 5.2. Interlayer Stresses and Adhesion. 5.3. Low Thermal Budget. 5.4. References. 6: Applications. 6.1. 2D Interconnections in ICs. 6.2. Integration into 2D Packaging. 6.3. Flex Circuits. 6.4. Large Area Power Distribution. 6.5. Integration into 3D Structures. 6.6. Electromagnetic Considerations. 6.7. Power Electronics. 6.8. References. Index.

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