Build the microchips of the future with this revolutionary new information transfer technology
Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore’s Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.
Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.
In Artificial Plasmonics for VLSI Interconnects, readers will also find:
Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.
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Soumitra R. Joy is an Assistant Professor in the Department of Electrical and Computer Engineering at the University of North Carolina at Charlotte, USA. Before joining academia, he served as a device reliability engineer at Intel Corporation for four years. He earned his Ph.D. in Electrical Engineering from the University of Michigan, Ann Arbor, MI, USA, and is recognized for his research in artificial plasmonics and semiconductor devices.
Pinaki Mazumder, PhD, is a Professor in the Department of Electrical Engineering and Computer Science at the University of Michigan, Ann Arbor, MI, USA. He is a Fellow of both the IEEE and AAAS and internationally recognized for his research in the diverse aspects of VLSI circuits and systems design.
Build the microchips of the future with this revolutionary new information transfer technology
Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore’s Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.
Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.
In Artificial Plasmonics for VLSI Interconnects, readers will also find:
Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.
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