Discover cutting-edge techniques for next-generation integrated circuit design, and learn how to deliver improved speed, density, power, and cost.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Xicheng Jiang is Distinguished Engineer and Director of Electrical Design Engineering at Broadcom Corporation. He is a former Associate Editor of IEEE Transactions on Circuits and Systems II, holds more than 30 issued and pending US patents, and is a Fellow of the IEEE.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABBB-136239
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABBB-132060
Anbieter: AMM Books, Gillingham, KENT, Vereinigtes Königreich
Hardcover. Zustand: Very Good. In stock ready to dispatch from the UK. Artikel-Nr. mon0000210232
Anzahl: 2 verfügbar
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Zustand: Used. Artikel-Nr. 322525893
Anzahl: 1 verfügbar
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: Used. Artikel-Nr. 18323937552
Anzahl: 1 verfügbar
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Artikel-Nr. ria9781107096103_new
Anzahl: Mehr als 20 verfügbar
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
Hardcover. Zustand: Brand New. 1st edition. 413 pages. 9.00x6.00x1.00 inches. In Stock. Artikel-Nr. x-1107096103
Anzahl: 2 verfügbar
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. Discover cutting-edge techniques for next-generation integrated circuit design, and learn how to deliver improved speed, density, power, and cost. Editor(s): Jiang, Xicheng. Num Pages: 413 pages, 327 b/w illus. 30 tables. BIC Classification: TJFC. Category: (U) Tertiary Education (US: College). Dimension: 183 x 253 x 24. Weight in Grams: 976. . 2015. Illustrated. hardcover. . . . . Books ship from the US and Ireland. Artikel-Nr. V9781107096103
Anzahl: Mehr als 20 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Achieve enhanced performance with this guide to cutting-edge techniques for digitally-assisted analog and analog-assisted digital integrated circuit design. ¿ Discover how architecture and circuit innovations can deliver improved performance in terms of speed, density, power, and cost ¿ Learn about practical design considerations for high-performance scaled CMOS processes, FinFet devices and architectures, and the implications of FD SOI technology ¿ Get up to speed with established circuit techniques that take advantage of scaled CMOS process technology in analog, digital, RF and SoC designs, including digitally-assisted techniques for data converters, DSP enabled frequency synthesizers, and digital controllers for switching power converters. With detailed descriptions, explanations, and practical advice from leading industry experts, this is an ideal resource for practicing engineers, researchers, and graduate students working in circuit design. Artikel-Nr. 9781107096103
Anzahl: 1 verfügbar