LCP for Microwave Packages and Modules Hardback (The Cambridge RF and Microwave Engineering Series) - Hardcover

Pham; Chen; Aihara

 
9781107003781: LCP for Microwave Packages and Modules Hardback (The Cambridge RF and Microwave Engineering Series)
Hardcover
ISBN 10: 1107003784 ISBN 13: 9781107003781
Verlag: Cambridge University Press, 2012

Inhaltsangabe

A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels.

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Über die Autorinnen und Autoren

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012.

Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

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Verlag
Cambridge University Press
Erscheinungsdatum
2012
Sprache
Englisch
ISBN 10 
1107003784
ISBN 13 
9781107003781
Einband
Tapa dura
Anzahl der Seiten
266
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Avery
https://www.avery.fr/

chemin des peupliers 27
Dardilly
Frankreich