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Computer-Aided Design and VLSI Device Development: 53 (The Springer International Series in Engineering and Computer Science, 53) - Hardcover

 
9780898382778: Computer-Aided Design and VLSI Device Development: 53 (The Springer International Series in Engineering and Computer Science, 53)

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examples are presented. These chapters are intended to introduce the reader to the programs. The program structure and models used will be described only briefly. Since these programs are in the public domain (with the exception of the parasitic simulation programs), the reader is referred to the manuals for more details. In this second edition, the process program SUPREM III has been added to Chapter 2. The device simulation program PISCES has replaced the program SIFCOD in Chapter 3. A three-dimensional parasitics simulator FCAP3 has been added to Chapter 4. It is clear that these programs or other programs with similar capabilities will be indispensible for VLSI/ULSI device developments. Part B of the book presents case studies, where the application of simu­ lation tools to solve VLSI device design problems is described in detail. The physics of the problems are illustrated with the aid of numerical simulations. Solutions to these problems are presented. Issues in state-of-the-art device development such as drain-induced barrier lowering, trench isolation, hot elec­ tron effects, device scaling and interconnect parasitics are discussed. In this second edition, two new chapters are added. Chapter 6 presents the methodol­ ogy and significance of benchmarking simulation programs, in this case the SUPREM III program. Chapter 13 describes a systematic approach to investi­ gate the sensitivity of device characteristics to process variations, as well as the trade-otIs between different device designs.

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examples are presented. These chapters are intended to introduce the reader to the programs. The program structure and models used will be described only briefly. Since these programs are in the public domain (with the exception of the parasitic simulation programs), the reader is referred to the manuals for more details. In this second edition, the process program SUPREM III has been added to Chapter 2. The device simulation program PISCES has replaced the program SIFCOD in Chapter 3. A three-dimensional parasitics simulator FCAP3 has been added to Chapter 4. It is clear that these programs or other programs with similar capabilities will be indispensible for VLSI/ULSI device developments. Part B of the book presents case studies, where the application of simu­ lation tools to solve VLSI device design problems is described in detail. The physics of the problems are illustrated with the aid of numerical simulations. Solutions to these problems are presented. Issues in state-of-the-art device development such as drain-induced barrier lowering, trench isolation, hot elec­ tron effects, device scaling and interconnect parasitics are discussed. In this second edition, two new chapters are added. Chapter 6 presents the methodol­ ogy and significance of benchmarking simulation programs, in this case the SUPREM III program. Chapter 13 describes a systematic approach to investi­ gate the sensitivity of device characteristics to process variations, as well as the trade-otIs between different device designs.

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9781461289562: Computer-Aided Design and VLSI Device Development: 53 (The Springer International Series in Engineering and Computer Science)

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ISBN 10:  1461289564 ISBN 13:  9781461289562
Verlag: Springer, 2011
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Cham, Kit Man; Oh, Soo-Young; Chin, Daeje; Moll, John L.; Lee, Keunmyung; and, Voorde, Paul Vande
ISBN 10: 0898382777 ISBN 13: 9780898382778
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Hardcover. Second Edition. Octavo, vii, xi, 379 pages. In Very Good condition. Bound in the publisher's blue cloth bearing white and black lettering to the spine. Boards have light wear exteriorly including minor wear to the edges and very sparse, tiny incidental marks. Mildly bowed boards with lightly sunned spine. Text block has extremely slight wear to the edges. Two ex-library markings interiorly. Illustrated. Second edition. NOTE: Shelved in Netdesk Column H, ND-H. 1379761. FP New Rockville Stock. Artikel-Nr. 1379761

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Kit Man Cham; Soo-Young Oh; Moll, John L.; Keunmyung Lee; Vandevoorde, Paul
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ISBN 10: 0898382777 ISBN 13: 9780898382778
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ISBN 10: 0898382777 ISBN 13: 9780898382778
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - examples are presented. These chapters are intended to introduce the reader to the programs. The program structure and models used will be described only briefly. Since these programs are in the public domain (with the exception of the parasitic simulation programs), the reader is referred to the manuals for more details. In this second edition, the process program SUPREM III has been added to Chapter 2. The device simulation program PISCES has replaced the program SIFCOD in Chapter 3. A three-dimensional parasitics simulator FCAP3 has been added to Chapter 4. It is clear that these programs or other programs with similar capabilities will be indispensible for VLSI/ULSI device developments. Part B of the book presents case studies, where the application of simu lation tools to solve VLSI device design problems is described in detail. The physics of the problems are illustrated with the aid of numerical simulations. Solutions to these problems are presented. Issues in state-of-the-art device development such as drain-induced barrier lowering, trench isolation, hot elec tron effects, device scaling and interconnect parasitics are discussed. In this second edition, two new chapters are added. Chapter 6 presents the methodol ogy and significance of benchmarking simulation programs, in this case the SUPREM III program. Chapter 13 describes a systematic approach to investi gate the sensitivity of device characteristics to process variations, as well as the trade-otIs between different device designs. Artikel-Nr. 9780898382778

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