This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
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Karl J. Puttlitz, Kathleen A. Stalter
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Anbieter: Salish Sea Books, Bellingham, WA, USA
Zustand: Good. Good++; Hardcover; Covers are clean and glossy; Couple of small spot-marks to the right textblock, otherwise unblemished textblock edges; Name on the front endpaper, otherwise endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, 9.75" - 10.75" tall); 4.3 lbs; Green covers with title in black lettering; 2004, CRC Press; 1048 pages; "Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)," by Karl J. Puttlitz & Kathleen A. Stalter. Artikel-Nr. SKU-1007AC02403205
Anzahl: 1 verfügbar
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,2050grams, ISBN:9780824748708. Artikel-Nr. 9947242
Anzahl: 1 verfügbar
Anbieter: moluna, Greven, Deutschland
Gebunden. Zustand: New. Karl J. Puttlitz, Kathleen A. StalterThis reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class. Artikel-Nr. 595074527
Anzahl: Mehr als 20 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware - Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. Artikel-Nr. 9780824748708
Anzahl: 2 verfügbar