Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering, 170) - Hardcover

Buch 71 von 115: Mechanical Engineering

Puttlitz, Karl J. (IBM, East Fishkill, New York, USA); Stalter, Kathleen A. (IBM, Fishkill, New York, USA)

 
9780824748708: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering, 170)

Inhaltsangabe

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

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Über die Autorin bzw. den Autor

Karl J. Puttlitz, Kathleen A. Stalter

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