The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,650grams, ISBN:9780792392965. Artikel-Nr. 5790256
Anzahl: 1 verfügbar
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,650grams, ISBN:9780792392965. Artikel-Nr. 5834233
Anzahl: 1 verfügbar
Anbieter: NEPO UG, Rüsselsheim am Main, Deutschland
Zustand: Gut. Auflage: 1993. 244 Seiten ex Library Book aus einer wissenschafltichen Bibliothek Sprache: Englisch Gewicht in Gramm: 545 24,7 x 16,5 x 2,1 cm, Broschiert. Artikel-Nr. 372197
Anzahl: 1 verfügbar
Anbieter: Buchmarie, Darmstadt, Deutschland
Zustand: Good. Ältere Ausgabe. Auflage: 1993. Artikel-Nr. 3291200_7b4_3x
Anzahl: 1 verfügbar
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Artikel-Nr. ria9780792392965_new
Anzahl: Mehr als 20 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level. Artikel-Nr. 9780792392965
Anzahl: 1 verfügbar