Advances in Thermal Modelling of Electronic Components and Systems v. 2 (Advances in Thermal Modeling of Electronic Components and Systems) - Hardcover

Reseña del editor

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

Biografía del autor

ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates, a consulting firm in Pacific Grove, California. He is a former faculty member in the Electrical Engineering Department of the Naval Postgraduate School in Monterey, California.

AVRAM BAR-COHEN is Professor and Director of the Thermodynamics and Heat Transfer Division in the Mechanical Engineering Department of the University of Minnesota.

Kraus, ADK Associates, Aurora, Ohio.