Accurate thermal modeling and the design of microelectronic devices and thin-film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat-removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modeling methods that must be employed in order to determine a device's temperature profile.
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PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000. Artikel-Nr. CX-9780750328746
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PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000. Artikel-Nr. CX-9780750328746
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