Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
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Armin Rahn is the author of The Basics of Soldering, published by Wiley.
Most books on soldering work like cookbooks; they purport to offer the correct recipe for every task and each new situation. More realistically, this book helps engineers and quality controllers to adapt techniques and processes to changing situations along the electronics production cycle by affording them with an environment in which production problems can be solved through flexible thinking based on scientific fact. It achieves this aim in great part by providing a clear and coherent blending of the chemical and physical theory behind soldering technology with practical applications in the electronics manufacturing industry. Throughout The Basics of Soldering the focus is on the complex interrelationships of the different parameters. Through-hole and surface-mounted joining are treated in full, as are cleaning and statistical quality control. Instead of just the usual "cooking recipes" found in most books on the subject, readers will find well-founded scientific theories combined with exhaustive coverage of contemporary methods and materials and a thorough understanding of real-world applications of soldering technology. The result is faster problem solving, more effective training of new personnel, and a better understanding of soldering and related technologies. Because it is based on a successful seminar series, The Basics of Soldering is also an excellent teaching tool, well suited to both graduate and upper level undergraduate courses.
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Anbieter: moluna, Greven, Deutschland
Zustand: New. Describing the different soldering methods in use today, this guide presents both their theory and practical applications. It covers the topics of cleaning, statistical quality control, through-hole and joining. The author relates all theory to practical, o. Artikel-Nr. 446917346
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Buch. Zustand: Neu. Neuware - Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure. Artikel-Nr. 9780471584711
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Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. Describing the different soldering methods in use today, this guide presents both their theory and practical applications. It covers the topics of cleaning, statistical quality control, through-hole and joining. The author relates all theory to practical, on-site situations. Num Pages: 400 pages, index. BIC Classification: TDM; TGX; TNT. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 236 x 163 x 28. Weight in Grams: 696. . 1993. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. Artikel-Nr. V9780471584711
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