Handbook of Thick- and Thin-Film Hybrid Microelectronics - Hardcover

Über die Autorin bzw. den Autor

TAPAN K. GUPTA, PhD, received an MA in Physics from Indian Institute of Technology, a PhD in Physics from Boston College, and was a Post Doctoral Fellow in the Electrical Engineering and Communication Department at Lehigh University. A former Analog Devices Career Development professor in the Electrical Engineering Department at Tufts University, Dr. Gupta is currently a senior research scientist in the advanced materials group at Radiation Monitoring Devices, MA. He is also responsible for the synthesis and characterization of new materials and their applications in nuclear medicine at the Massachusetts Institute of Technology, Cambridge, MA. Dr. Gupta has authored a book chapter on solar cells and materials for Allied Publications, New Delhi, and more than forty-five peer-reviewed articles in the field of physics, material science, and semiconductor physics.

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Thick and thin film hybrid microelectronics has revolutionized the microelectronics industry. Its flexibility, cost-effectiveness, programmability, precision, and broad range of applications–from cell phones to laptops–make this the technology of the future. Industry experts predict that in a few years, almost everything from shoes to windows to children’s toys will integrate microelectronics.

Handbook of Thick and Thin Film Hybrid Microelectronics is the definitive source of detailed information on all the important topics in modern hybrid microelectronics. This academically rigorous handbook presents a comprehensive treatment of materials, their characteristics, and their field of applications. Useful as a standard desk reference for professionals and as a textbook for students, this book provides insights into:

• Circuit design, layout, and fabrication of hybrid electronic circuits
• Both high and low frequency applications
• Packaging and thermal considerations
• Microwave integrated circuits
• Electronic materials and the engineering aspects of the multichip module (MCM)
• Application procedures for thick and thin films

Aus dem Klappentext

Thick and thin film hybrid microelectronics has revolutionized the microelectronics industry. Its flexibility, cost-effectiveness, programmability, precision, and broad range of applications–from cell phones to laptops–make this the technology of the future. Industry experts predict that in a few years, almost everything from shoes to windows to children’s toys will integrate microelectronics.

Handbook of Thick and Thin Film Hybrid Microelectronics is the definitive source of detailed information on all the important topics in modern hybrid microelectronics. This academically rigorous handbook presents a comprehensive treatment of materials, their characteristics, and their field of applications. Useful as a standard desk reference for professionals and as a textbook for students, this book provides insights into:

• Circuit design, layout, and fabrication of hybrid electronic circuits
• Both high and low frequency applications
• Packaging and thermal considerations
• Microwave integrated circuits
• Electronic materials and the engineering aspects of the multichip module (MCM)
• Application procedures for thick and thin films