Integrated Passive Component Technology - Hardcover

Über die Autorin bzw. den Autor

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

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An important real-world look at the status and future of integrated passives

This book provides an overview of the technology, potential applications, motivations, and problems associated with integrating resistors, capacitors, and inductors into circuit boards instead of mounting them as discrete components on the surface. Written primarily for engineers and scientists in industry who want to determine if passive integration is a viable option for a particular product, the text describes the processes available for designing and fabricating integrated passives, measuring their properties, and applying them to microelectronic systems.

In order to bring professionals up to date in this fast-moving technology and enable them to implement it into their own manufacturing environments, the editors address some basic questions concerning the tradeoffs between discrete and integrated approaches, including:

• What are the advantages and disadvantages of integrated passives?
• Is this processing compatible with existing substrates?
• Can integrated passives be made with conventional PWB fabrication equipment?
• How do the electrical characteristics of integrated passives differ from discretes?
• How are integrated passives designed?
• What must be considered in the economic analysis?

Integrated Passive Component Technology is the first book dedicated to this subject. A comprehensive survey of the state of the art, it will be an invaluable resource for engineers and materials scientists in the microelectronics industry. Interdisciplinary issues are presented in clearly delineated sections throughout the book so readers can pick those parts that are most beneficial to them.

Aus dem Klappentext

An important real-world look at the status and future of integrated passives

This book provides an overview of the technology, potential applications, motivations, and problems associated with integrating resistors, capacitors, and inductors into circuit boards instead of mounting them as discrete components on the surface. Written primarily for engineers and scientists in industry who want to determine if passive integration is a viable option for a particular product, the text describes the processes available for designing and fabricating integrated passives, measuring their properties, and applying them to microelectronic systems.

In order to bring professionals up to date in this fast-moving technology and enable them to implement it into their own manufacturing environments, the editors address some basic questions concerning the tradeoffs between discrete and integrated approaches, including:

• What are the advantages and disadvantages of integrated passives?
• Is this processing compatible with existing substrates?
• Can integrated passives be made with conventional PWB fabrication equipment?
• How do the electrical characteristics of integrated passives differ from discretes?
• How are integrated passives designed?
• What must be considered in the economic analysis?

Integrated Passive Component Technology is the first book dedicated to this subject. A comprehensive survey of the state of the art, it will be an invaluable resource for engineers and materials scientists in the microelectronics industry. Interdisciplinary issues are presented in clearly delineated sections throughout the book so readers can pick those parts that are most beneficial to them.