Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
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Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including: The importance of computer modeling in nanopackaging and offers suggestions for implementation Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control A comprehensive overview of nanoscale electronics and systems packaging Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging.
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Anbieter: Hamelyn, Madrid, M, Spanien
Zustand: Bueno. : Este libro ofrece una visión general completa de la electrónica a nanoescala y el empaquetado de sistemas. Cubre estructuras a nanoescala, empaquetado de nanoelectrónica, aplicaciones de nanocables en el empaquetado y ofrece una hoja de ruta para las tendencias futuras. Se estudian materiales compuestos para dieléctricos de alta k, resistencias e inductores, adhesivos eléctricamente conductores, "tintas" conductoras, rellenos de relleno inferior y mejora de la soldadura. El libro está dirigido a investigadores industriales y académicos, ingenieros de empaquetado de electrónica industrial que necesitan mantenerse al tanto de los avances en su campo, y otros con intereses en la nanotecnología. Examina la aplicación de las nanotecnologías al empaquetado de electrónica, tal como está representado por la investigación actual en todo el campo. EAN: 9780387473253 Tipo: Libros Categoría: Tecnología Título: Nanopackaging Autor: James E. Morris Editorial: Springer Idioma: en Páginas: 564 Formato: tapa dura. Artikel-Nr. Happ-2026-07-02-8b1dbdc5
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Anbieter: Phatpocket Limited, Waltham Abbey, HERTS, Vereinigtes Königreich
Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions. Artikel-Nr. Z1-J-005-01931
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Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABBB-10924
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
Zustand: New. pp. 568 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam. Artikel-Nr. 7405618
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Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABBB-69248
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABBB-158539
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Artikel-Nr. ABBB-39870
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Artikel-Nr. ria9780387473253_new
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Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive 'inks,' underfill fillers, and solder enhancement. 'Nanopackaging' is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field. Artikel-Nr. 9780387473253
Anzahl: 1 verfügbar
Anbieter: moluna, Greven, Deutschland
Gebunden. Zustand: New. Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packagingDiscusses the importance of computer modeling in nanopackaging and offers suggestions for. Artikel-Nr. 5910382
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