Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Softcover

Inhaltsangabe

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.