Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series) - Hardcover

Harman, George G.; Imaps

 
9780070326194: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (McGraw-Hill Electronic Packaging and Interconnection Series)
Hardcover
ISBN 10: 0070326193 ISBN 13: 9780070326194
Verlag: McGraw-Hill Professional, 1997

Inhaltsangabe

The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding inMicroelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichipmodules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Über die Autorin bzw. den Autor

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Von der hinteren Coverseite

The classic reference on wire bonding--expanded and updated! Wire Bonding in Microelectronics Second Edition the definitive single-volume reference on wire bonding just got better--in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies. Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. The book explains it all, with special emphasis on fine pitch bonding, bonding to MCMs, and additional areas that have been developed since the first edition was published. Readers will learn to: Understand the bonding technology; Test wire bonds; Make reliable bonds at a very high yield; Bond wires to multichip modules; Solve common bonding problems; Evaluate alternative bonding technologies; Improve bondability and reliability via more effective cleaning techniques.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
McGraw-Hill Professional
Erscheinungsdatum
1997
Sprache
Englisch
ISBN 10 
0070326193
ISBN 13 
9780070326194
Einband
Gebundene Ausgabe
Anzahl der Seiten
290
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar