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Verlag: Enso Books (edition First Edition), 2008
ISBN 10: 0982018533ISBN 13: 9780982018538
Anbieter: BooksRun, Philadelphia, PA, USA
Buch Erstausgabe
Paperback. Zustand: Fair. First Edition. Ship within 24hrs. Satisfaction 100% guaranteed. APO/FPO addresses supported.
Mehr Angebote von anderen Verkäufern bei ZVAB
Neu ab EUR 16,01
Gebraucht ab EUR 4,46
Mehr entdecken Softcover Erstausgabe
Verlag: Joanna Cotler Books, 1969
ISBN 10: 0060454156ISBN 13: 9780060454159
Buch
Zustand: Good. Good condition. (Politics, Government).
Verlag: The History Press, 2015
ISBN 10: 075096104XISBN 13: 9780750961042
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Buch
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,550grams, ISBN:9780750961042.
Verlag: Springer Netherlands, 2012
ISBN 10: 9401055173ISBN 13: 9789401055178
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Silicon, as an electronic substrate, has sparked a technological revolution that has allowed the realization of very large scale integration (VLSI) of circuits on a chip. These 6 fingernail-sized chips currently carry more than 10 components, consume low power, cost a few dollars, and are capable of performing data processing, numerical computations, and signal conditioning tasks at gigabit-per-second rates. Silicon, as a mechanical substrate, promises to spark another technological revolution that will allow computer chips to come with the eyes, ears, and even hands needed for closed-loop control systems. The silicon VLSI process technology which has been perfected over three decades can now be extended towards the production of novel structures such as epitaxially grown optoelectronic GaAs devices, buried layers for three dimensional integration, micromechanical mechanisms, integrated photonic circuits, and artificial neural networks. This book begins by addressing the processing of electronic and optoelectronic devices produced by using lattice mismatched epitaxial GaAs films on Si. Two viable technologies are considered. In one, silicon is used as a passive substrate in order to take advantage of its favorable properties over bulk GaAs; in the other, GaAs and Si are combined on the same chip in order to develop IC configurations with improved performance and increased levels of integration. The relationships between device operation and substrate quality are discussed in light of potential electronic and optoelectronic applications.
Verlag: Springer US, 2011
ISBN 10: 1461278570ISBN 13: 9781461278573
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Verlag: Springer Netherlands, 1989
ISBN 10: 0792301544ISBN 13: 9780792301547
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Verlag: Oxford. 1975., 1975
Anbieter: Antiquariat am Flughafen, Berlin, Deutschland
Softcover. Obr. 8° quadr. 19 SS. mit Abb. sehr gutes Ex. in englischer Sprache (in english).
Verlag: CHAPMAN & HALL LTD., 1994
ISBN 10: 0412547406ISBN 13: 9780412547409
Anbieter: Martin Preuß / Akademische Buchhandlung Woetzel, Kerzenheim, Deutschland
Verbandsmitglied: BOEV
Buch
32. Zustand: Wie neu. 1994. 880 pp., illustrations and tables, 25 x 19 cm, Hardcover Hier wird erstmals eine umfassende Übersicht über die Demenz in einem Band geboten. Dabei wird sowohl auf die klinischen Syndrome der Demenz eingegangen, als auch auf die spezifischen Störungen, die der Krankheit zugrunde liegen. Das Buch ist in zwei Hau Sprache: Deutsch.
Verlag: Edward Elgar Publishing Ltd, 2002
ISBN 10: 1858989701ISBN 13: 9781858989709
Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
Buch
Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. Dust jacket in good condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9781858989709.
Verlag: CU Art Galleries, (Boulder, Colorado), 1992
Anbieter: Between the Covers-Rare Books, Inc. ABAA, Gloucester City, NJ, USA
Erstausgabe
Softcover. Zustand: Near Fine. Exhibition catalog. Slim quarto. 18pp. Heavily illustrated. Tiny faint stain on cover else just about fine in glossy wrappers. With a card featuring event information and author bios (horizontal crease) laid in. Features an introductory essay by gallery director Michael Crane; biographies by B. L. Kennedy; "Patchen, levy, and language" by D. R. Wagner; the poem "for Kenneth Patchen" by Anne Waldman; "An Interior Burning: The Silence of d. A. levy's Zen Concrete" by Ingrid Swanberg; and "Meeting d. a. levy" by Kent Taylor.
Erscheinungsdatum: 1979
Anbieter: ConchBooks, Harxheim, Deutschland
Treated genera: Discorbis, Trochulina, Rotorbinella, Lamellodiscorbis, Neoconorbina, Gavelinopsis, Rosalina, Conorbina 23 pp., 5 figs, 4 plates, gr. 8.
Verlag: ENSO BOOKS, 2010
ISBN 10: 0982018509ISBN 13: 9780982018507
Anbieter: moluna, Greven, Deutschland
Buch
Zustand: New. Klappentext The 52nd Floor sees leadership as a journey--what real people do in real time to create practical value right now. Here is a natural and realistic practice that we can take to make our leadership journeys successful.--James .
Verlag: Teachers College Press 2022-12-30, New York, 2022
ISBN 10: 0807767484ISBN 13: 9780807767481
Anbieter: Blackwell's, London, Vereinigtes Königreich
Buch
paperback. Zustand: New. Language: ENG.
Verlag: Natl Underwriter Co, 2002
ISBN 10: 0872182916ISBN 13: 9780872182912
Anbieter: Books From California, Simi Valley, CA, USA
Buch
Paperback. Zustand: Good.
Verlag: La tour de Feu no. 47, automne 1955, 1955
Anbieter: BOOKIT!, Genève, Schweiz
Zustand: Used: Like New. Couverture souple, comme neuf.
Verlag: Masson, Paris, 1998
Anbieter: le livre ouvert. Isabelle Krummenacher, Cossonay-Ville, Schweiz
Buch
Couverture souple. Zustand: Bon. 210x135mm. 227 pages. Ouvrage de bibliothèque. 3ème édition.
Verlag: Masson, Paris, 1989
Anbieter: le livre ouvert. Isabelle Krummenacher, Cossonay-Ville, Schweiz
Buch
Couverture souple. Zustand: Bon. 215x140mm. 238 pages. Ouvrage de bibliothèque.
Verlag: Springer Berlin Heidelberg, 2012
ISBN 10: 3642860028ISBN 13: 9783642860027
Anbieter: moluna, Greven, Deutschland
Buch
Zustand: New.
Verlag: Lettres de l'école freudienne, N°11, septembre 1973. Un volume in-4°, broché., 1973
[16643].
Verlag: Genève, La raison, n° 8, mai 1954. In-8, broché., 1954
[8377].